Minimizing post processing by using picosecond lasers

Dr. Geoff Shannon will discuss picosecond lasers and applications during his presentation at the MicroManufacturing Conference & Exhibits.

Monrovia, CA - Dr. Geoff Shannon of Miyachi Unitek will present "Micro Machining Capabilities using a 355 nm and 1064 nm Picosecond Laser" at the MicroManufacturing Conference & Exhibits on April 16-17 in Minneapolis, MN.

Shannon will discuss new picosecond lasers that can provide unique features in metals and polymers as well as minimize the requirement for post-process cleaning operations. Picosecond lasers have pulse durations of around 10 picosec, which enables micromachining of metals with negligible heat effect zones. The large peak powers create mostly vaporized materials, so very little material is redeposited. At these picosecond pulse durations, the laser can be operated in 355 nm, 532 nm, and 1064 nm. Depending upon the application, users can take advantage of the lower wavelength for minimal feature size or the longer wavelength for more average power.

The presentation will include an overview of the new picosecond laser technology along with application examples. Materials to be discussed include stainless steel, nitinol, titanium, pebax, pelathane, and PLLA in the sub 200 micron thickness range.

Miyachi Unitek is a manufacturer of equipment and systems for resistance welding, laser welding, laser marking, laser cutting, and hot bar reflow soldering and bonding. The company provides products to a wide range of markets, including the medical device, battery, electric vehicle, and solar industries, as well as the global electronics, automotive, and general industrial markets.

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