EOS Electro Optical Systems and TRUMPF Werkzeugmaschinen have signed an agreement with MCP Tooling Technology in Stone, UK, and MCP-HEK Tooling in Germany. Under the agreement, both MCP companies receive a non-exclusive license for certain EOS and TRUMPF patent rights regarding the laser sintering process.
The parties have agreed not to disclose the level of license fees to be paid by MCP.
Laser sintering is a key technology for e-Manufacturing, the fast, flexible, and cost-effective production of products, patterns, or tools. The technology manufactures parts for every phase of the product life cycle, directly from electronic data. Laser sintering accelerates product development and optimizes production processes.