Ultratech receives follow-on order for laser spike annealing system
Ultratech received a follow-on order from a major foundry in Asia for its LSA101 laser spike annealing system.
Ultratech (San Jose, CA), which supplies lithography, laser processing, and inspection systems used to manufacture semiconductor devices and high-brightness LEDs, received a follow-on order from a major foundry in Asia for its LSA101 laser spike annealing system. Equipped with a dual-beam option, the system provides a second low-power laser that adds flexibility for annealing at low substrate temperatures. This capability is required for advanced applications, such as gate stack formation, silicide, or post-silicide anneal. The tool will be used to support the foundry's 28 and 40nm production efforts, and Ultratech expects to ship the system in the third quarter of 2016.
Founded in 1979, Ultratech serves three core markets: front-end semiconductor, back-end semiconductor, and nanotechnology. The company supplies lithography products for bump packaging of integrated circuits and high-brightness LEDs, and is a pioneer of laser spike anneal technology for producing advanced semiconductor devices.
For more information, please visit www.ultratech.com.