3D-Micromac receives order for excimer laser lift-off system

The laser lift-off system provides highly uniform, force-free lift-off of flexible layers on large surface areas and at high speeds.

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Laser micromachining and roll-to-roll laser systems supplier 3D-Micromac (Chemnitz, Germany) has received an order for the company's microMIRA excimer laser lift-off system from high-resolution digital sensors maker dpiX (Colorado Springs, CO). The system will be shipped to dpiX, where it will provide laser lift-off processing from Gen 4.5 glass substrates used in manufacturing x-ray sensors for medical, industrial, and military applications.

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The microMIRA laser lift-off system provides highly uniform, force-free lift-off of flexible layers on large surface areas and at high speeds (up to 500 wafers/hour and up to 200 sheets/hour on Gen 6 substrates, depending on the application). The system, built on a highly customizable platform, can incorporate different laser sources, wavelengths, and beam paths to meet customer requirements.

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The new microMIRA excimer laser lift-off system from 3D-Micromac.

The system can be used for applications such as device lift-off from glass and sapphire substrates in semiconductor manufacturing, as well as organic light-emitting diode (OLED) and microLED display manufacturing. Additional applications include laser annealing and crystallization for surface modification, including printed electronics such as near-field communication (NFC) sensors and tags.

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The microMIRA system can be used for device lift-off from glass and sapphire substrates in semiconductor manufacturing.

For more information, please visit www.3d-micromac.com and www.dpix.com.

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