Selective laser annealing system
The microPRO RTP laser annealing system combines a laser optic module with a modular semiconductor wafer processing platform.
The microPRO RTP laser annealing system from 3D-Micromac (Chemnitz, Germany) combines a laser optic module with the company's modular semiconductor wafer processing platform to provide selective annealing with high repeatability and throughput. Features include a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional laser wavelengths (near-infrared, green, and ultraviolet). The system addresses a variety of applications, including semiconductor, power device, and MEMS manufacturing.
For more information, please visit www.3d-micromac.com.