Laser micromachining systems maker 3D-Micromac (Chemnitz, Germany) reports that its total-received order volume for its microCELL TLS high-throughput half-cell cutting tools tops 1.5GW for tool deliveries in 2017 to date.
The microCELL TLS systems use thermal laser separation for cleaving solar cells into half-cells. This process provides a multitude of mechanical and electrical benefits to customers. The separated cells show a significantly higher mechanical strength, better edge quality, and lower power reduction compared to laser scribing and cleaving approaches. A module power gain >1W was seen with TLS compared to conventional scribe and break methods, in addition to the 5–7W per-module gain of half-cell module technology.
|The microCELL TLS laser system from 3D-Micromac uses thermal laser separation for half-cell cutting of solar cells.|
The company also introduced its second-generation microCELL OTF system for laser contact opening (LCO) of passivated emitter rear contact (PERC) solar cells, which achieves throughput of 8000 wafers per hour.
For more information, please visit http://lasers-for-photovoltaics.com.