Ultratech nails down supplier deals with chip packaging heavyweights
The company has inked multiyear agreements with several global top-tier advanced packaging companies, comprising most of the electroplated flip-chip market Ultratech addresses.
San Jose, CA -- Ultratech Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), has agreed to "exclusive supplier" and "preferred tool vendor" multiyear agreements with several top-tier advanced packaging (AP) companies around the world. Combined, these companies account for almost 60 percent of the electroplated flip-chip market that market-leader Ultratech currently addresses. These agreements, along with the recent acquisition of over 200 US and foreign AP patents, strategically position Ultratech to meet the lithography packaging requirements for the future device nodes of its global customer base.
Customers of Ultratech, a leader in AP for nearly a full decade, "understand the technical and economic advantages our tools deliver for advanced volume manufacturing," stated Manish Ranjan, Ultratech's VP of advanced packaging technology/nanotechnology markets. The new agreements, he added, "highlight the close working relationship that Ultratech has with its strategic customers," as well as "provide valuable insight for the development of market-specific features that enable our customers' next-generation devices."