Dyconex adds Hitachi CO2/UV tool for PCB laser drilling
Dyconex has purchased a CO2/UV Combi-Laser from Hitachi which will "considerably increase" the company's processing of high-density interconnection (HDI) printed circuit boards (PCB).
Bassersdorf, Switzerland -- Dyconex, a Micro Systems Technology company, has purchased a CO2/UV Combi-Laser from Hitachi which the company says will "considerably increase" its processing of high-density interconnection (HDI) printed circuit boards (PCB).
HDI PCBs enable electrical conduction between wirings on each layer through interlayer vias; CO2 lasers are used extensively in processing these holes (typically ≤100 μm dia.). ILS' September-October issue, available in mid-September, will have a technical feature on CO2 laser-drilling of high-density PCB materials.
The new system, which comes with an automatic loading and unloading station, is particularly geared to boosting productivity and quality of blind-via formation for rigid substrates, which becomes "considerably faster" than conventional UV laser drilling, the company says.
Selective ablation rates of the system's two lasers (UV and COw) result in quality improvements. The CO2 laser's superior absorption properties in glass fibers leads to consistent and complete via opening in inhomogeneous glass-reinforced dielectrics. It also offers significantly improved accuracy when stopping the creation of a blind via exactly on the landing pad, thus avoiding electrical shorts caused by pad shoot-through, Dyconex explains.
(Image via Dyconex)