JPSA awarded LED wafer scribing process patent

J.P. Sercel Associates (JPSA) has been awarded a patent for its front-side laser scribing technique for LED wafers

JPSA has been awarded a patent for its front-side laser scribing technique for LED wafers. The patent is applicable in Korea. The patented technique involves the use of a unique laer energy distribution technique, allowing extremely narrow kerf widths - 2.5 microns wide - resulting in faster processing and higher yields. Narrower kerfs also yield more die per wafer.

JPSA developed the LED sapphire wafer dicing capability developed with the IX-200 Chromadice DPSS UV laser wafer singulation system. The new patented technique provides the ability to process wafers at higher yields for LED manufacturers, according to Jeffrey P. Sercel, president.

More in Micromachining