Semicoa finalizes research and testing program for laser marking guidelines

Semicoa has completed a seven-month research and testing program for advanced technology relating to laser marking of hermetic, packaged discrete semiconductor devices.

Costa Mesa, CA - Semicoa has completed a seven-month research and testing program for advanced technology relating to laser marking of hermetic, packaged discrete semiconductor devices.

Quality assurance is measured through the company's new non-contact microscope using a method that results in highly accurate depth measurements—without physical damage to a specimen. It provides adjustable measurements utilizing a high-definition camera and external monitor. The system is being used as a process monitor for every production lot marked by the new system to ensure stability and consistency in the marking depth.

The Defense Logistics Agency (DLA) Land and Maritime will be establishing new MIL-PRF requirements for device marking. The new guidelines will address the penetration of certain layers during the marking process. The company used these upcoming guidelines in the decision to purchase new marking equipment and provided the DLA with test results and samples.

This equipment demonstrates a step-function improvement in legibility, even on the smallest outline discrete semiconductor packages. The company was granted unrestricted use of this equipment by DLA and began shipping all products utilizing the new laser and measurement equipment in September 2014.

For more information, please visit www.semicoa.com.

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