Tokyo, Japan—Sumitomo Heavy Industries Ltd. has developed a high-precision UV laser for drilling micro-vias in a new printed circuit wiring board that it developed jointly with Sumitomo Bakelite Co. Ltd. and Sumitomo Metals Mining Co. Ltd. These boards will be used for the next-generation high-speed and high-density packages.
Each company contributed its specialty. Sumitomo Bakelite processed conventional benzoncylobutene to develop insulating layer materials. Sumitomo Metal Mining developed a processing solution for 50µm top diameter micro-via and an LS=30/30µm line width space, with excellent adhesion strength and reliable insulation via greater use of dry process.
Shinko Co. Ltd., (92 percent owned by Sumitomo Metal Mining) will market these products.