PCB maker Cicor adds ESI laser processing system to facility
The ESI laser processing system is optimized for flexible printed circuits widely used in consumer electronics, such as smartphones and other handheld devices.
Laser drilling systems maker ESI (Portland, OR), a MKS Instruments company (Andover, MA), has sold ESI CapStone printed circuit board (PCB) laser processing systems to Cicor (Bronschhofen, Switzerland), which manufactures highly complex PCB and hybrid circuits. Cicor is the first European PCB company to invest in the ESI UV laser drilling technology—the system, placed in Cicor's facility in Boudry, Switzerland, leverages beam positioning technology to help the company serve increasing customer demand for processing blind and through-hole vias in flexible printed circuits (FPCs).
The CapStone system enables copper opening and dielectric cleaning in a single pass. Its ESI AcceleDrill beam positioning technology enables the system to take advantage of the high power and high repetition rate of the its new laser to deliver processing efficiency.
The system is optimized for FPCs widely used in consumer electronics, such as smartphones and other handheld devices.