Laser processing platform
The ULTRA 9 laser processing platform performs laser cutting, ablation, and surface modification.
The ULTRA 9 laser processing platform from Universal Laser Systems (Scottsdale, AZ) performslaser cutting, ablation, and surface modification. Its advanced functionality includes high-accuracy beam positioning and auto-focus, collision detection, and smart path planning, enabling use in manufacturing, research and development, academic research, and prototyping. When configured with the company's MultiWave Hybrid technology, the platform can combine the laser energy of up to three wavelengths—9.3 µm (CO2), 10.6 µm (CO2), and 1.06 µm (fiber)—by focusing each spectral component into one beam. The user is able to select an ideal combination of wavelengths for the material, allowing for maximum process flexibility.
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