Ultrafast laser micromachining expands at JPSA
JPSA expands its product line for ultrafast pusle laser micromachining.
Manchester, New Hampshire – JP Sercel Associates, Inc. (JPSA), a world leader in advanced laser micromachining, announces the expansion of their Ultrafast processing capabilities. Utilizing innovative laser beam delivery techniques with the latest pico-second lasers, the company delivers high precision results for customers in high-volume production facilities. Markets include LED, semiconductor, solar, and bio-medical industries.
Experienced laser scientists in the Applications Laboratory have integrated pico-second laser systems at wavelengths ranging from UV to IR to provide precision machining, cutting, and hole drilling, with minimized thermal effects. JPSA pico-second laser systems provide high peak energy intensity, resulting from the short pulse duration, enabling these lasers to increase coupling with materials that are typically transparent to lasers with longer pulse widths. The company’s patent-pending beam delivery technologies significantly enhance the pico-second laser machining throughputs up to 10 times faster than laser materials processing competitors performing similar applications.
Jeffrey Sercel,CEO of JPSA said, “We have begun first shipment of our IX-6168 Micromachining System configured with a pico-second laser and galvanometer to manufacturing customers. Applications range from cutting, hole-drilling, via-drilling, texturing, thin film removal/patterning, to machining of 3D features. Many applications and materials benefit from the clean pico-second laser ablation.“
For more information, visit www.jpsalaser.com.