Metal dicing, scribing system for LEDs

JP Sercel Associates' new IX-6100-MD can scribe and dice a variety of metal layers and alloys used in LED manufacturing.

JP Sercel Associates' IX-6100-MD performs metal dicing and scribing for LED manufacturing
JP Sercel Associates' IX-6100-MD performs metal dicing and scribing for LED manufacturing

JP Sercel Associates (JPSA), Manchester, NH, has released a new system for scribing and dicing metal layers and alloys used in LED manufacturing.

The IX-6100-MD can scribe and dice a variety of metal layers (Mo, Cu, Ni, Au, Ag, Zn) and their alloys used in LED manufacturing. A proprietary beam delivery system enables independent 2D adjustment of the laser beam shape, to optimize the laser energy used for cutting and achieve a minimal kerf width (20 μm) while minimizing the heat-affected zone. JPSA's proprietary vision and scribe placement technology reduces die street size and enables more LED die per wafer. The system can be equipped with the company's Integrated Automation Platform (IAP) for automated wafer handling in production environments.

JPSA says it will ship several of the new IX-6100-MD systems in 3Q12 to an unidentified leading LED manufacturer in Asia, to be utilized for singulating high-power LED devices in which the metal substrate assists in LED heat dissipation.

Jpsa Ix 6100 Md Metal Dicing 206x142

Cross-section of 60 μm copper. (Source: JPSA)

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