3D-Micromac AG acquires laser technology for separating microchip components

Know-how, patents, and results from Jenoptik’s development of thermal laser beam separation were transferred to 3D-Micromac AG.

Content Dam Ils En Articles 2014 01 3d Micromac Ag Acquires Laser Technology For Separating Microchip Components Leftcolumn Article Thumbnailimage File

Chemnitz, Germany - Jenoptik and 3D-Micromac AG have completed a technology transfer of thermal laser beam separation (TLS-Dicing) as part of a so-called asset deal. As of January 1, 2014, know-how, patents, and results of the development from Jenoptik's Laser & Materials Processing Division were transferred to 3D-Micromac AG in Chemnitz.

TLS-Dicing is used in the semiconductor industry's back-end to separate semiconductor wafer in components. A laser heats up the material locally, and a cooling medium cools it down immediately afterwards. The thermally induced mechanical stress leads to a complete cleaving of the wafer.

Immediate commercialization of the technology by 3D-Micromac will be possible with the transfer. With the acquisition, the company reinforces its know-how as a system provider for laser systems in the semiconductor industry and advances the expansion of its product portfolio in this area. Jenoptik's Laser & Materials Processing Division will continue in the future to focus on the 3D processing of plastics and metals, e.g., in the automobile industry.

"With TLS-Dicing we obtain a technology that will perfectly complement our product portfolio in the semiconductor industry and enable us to expand our market position. In addition to component processing at the wafer level we can now also offer innovative solutions for separating of microchips," said Tino Petsch, CEO of 3D-Micromac AG. "In the coming months, we will continue to further develop the process in co-operation with the Fraunhofer IISB and implement it in industry-ready machine technology."

"Jenoptik's Laser & Materials Processing Division has increasingly focused on its core markets and sharpened its portfolio in recent months," said Dietmar Wagner, general manager of JENOPTIK Automatisierungstechnik GmbH, following the contract's signing. "We are pleased that with 3D-Micromac AG we have found a buyer for TLS-Dicing, which wants to successfully commercialize the technology in the shortest possible time."

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Photo: Thermal laser separation. Courtesy of Jenoptik

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