A-Laser intros laser direct structuring capability for manufacturing 3D circuitry

A-Laser, a division of FCT Assembly, has introduced a new laser direct structuring (LDS) capability that has utility in the molded interconnect device (MID) market, as it brings flexibility to design and product capability with potential for significant cost savings.

Milpitas, CA - A-Laser, a division of FCT Assembly, has introduced a new laser direct structuring (LDS) capability that has utility in the molded interconnect device (MID) market, as it brings flexibility to design and product capability with potential for significant cost savings.

There are three components to the development process for manufacturing LDS 3D circuits. Prototypes are developed with a proprietary proto-paint process in combination with a raw part from virtually any plastic. Next, the manufacturing industry has seen a number of innovations in the realm of 3D-printed parts through advancements in materials and printing technology. Due to the quick-turn nature of this process, cycle times can be greatly reduced in the development phase. Lastly, mold-injected parts, from LDS-grade materials, can be brought to full-scale production.

MIDs provide enormous technical and economic potential while offering improved ecological behavior in comparison to conventional printed circuit boards. MIDs complement circuitry that would be impossible to achieve with other technologies. In the LDS process, a part is normally made from a plastic material containing an LDS additive. The laser etches conductive trace structures onto any properly designed surface. Copper, followed by nickel and gold layers, are built up on these structures in a subsequent metallization bath.

For more information about the company's LDS capability, visit http://a-laser.com/3dcircuits.html.

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