High-resolution chipsets for 3D printing

Texas Instruments (TI) has introduced two high-resolution digital light processing (DLP) chipsets for use in 3D printing.

Dallas, TX - Texas Instruments (TI) has introduced two high-resolution digital light processing (DLP) chipsets for use in 3D printing. The DLP9000 and DLP6500 digital micromirror devices (DMDs), each programmable by the company's DLPC900 controller, are said to deliver higher resolution imaging, extended wavelength support, and faster pattern rates compared to previous devices.

The DLP9000 offers four million pixels, or a 2560 x 1600 micromirror array, and can be used to build large, advanced resolution objects in 3D printing and scan larger objects at longer throw distances. For cost-sensitive applications, the DLP6500 offers up to two million pixels, or a 1920 x 1080 (1080p) micromirror array.

Key features of both chipset versions include programmable pattern rates up to 9500Hz for fast 3D measurements and product builds; optimization for wavelengths from 400 to 700nm; and compatibility with widely available resins for 3D printing.

For more information, please visit www.ti.com/dlphighresolution.

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