Laser direct structuring

A-Laser offers laser direct structuring (LDS) capabilities for producing molded interconnect devices (MIDs), which couple integrated circuit traces and molded thermoplastic parts.

Dec 3rd, 2015
Content Dam Ils Online Articles 2015 December Mid3 Web

A-Laser offers laser direct structuring (LDS) capabilities for producing molded interconnect devices (MIDs), which couple integrated circuit traces and molded thermoplastic parts. The company's LDS process activates the material to allow conductive traces onto the plastic surface. The metallization process starts with a copper bath, after which time application-specific coatings such as nickel, gold, tin, tin/lead, silver, and silver/palladium, among others, are possible. Applications include hearing aids, blood glucose meters, remote patient monitoring systems, drug delivery systems, disposable catheter interfaces, neurostimulation controllers, and Integrated Radio-Frequency Identification (RFID) solutions.

For more information, please visit www.a-laser.com.

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