Ultratech's lithography systems chosen for next-generation wafer-level packaging application

San Jose, CA - Ultratech (Nasdaq: UTEK), a supplier of lithography laser processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, has received a large multiple-system order from a leading semiconductor manufacturer for its advanced packaging AP300 lithography systems. The AP300 systems will be utilized for high-volume, fan-out wafer-level packaging (WLP) applications used to manufacture leading-edge chips. Ultratech will begin shipping the systems in Q4FY15 to the customer's facility in Taiwan.

The strong demand for thin mobile communication devices such as smartphones and tablets continues to drive growth in WLP. Because of the costs associated with 3D through-silicon via (TSV) architectures, industry analysts regard fan-out WLP as an effective solution for the highly demanding mobile and wireless market, where the focus is on delivering high performance coupled with a small form factor.

The AP300 family of lithography systems is built on the company's customizable Unity Platform, delivering superior overlay, resolution, and side wall profile performance and enabling highly-automated and cost-effective manufacturing. These systems are particularly well suited for copper pillar, fan-out, TSV, and silicon interposer applications. The platform has numerous application-specific product features to enable next-generation packaging techniques, such as the company's award-winning dual-side alignment (DSA) system, utilized around the world in volume production.



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