High-power laser packaging

OSI LD_S

Edison, NJ - OSI Laser Diode Inc. (LDI), an OSI Systems Company, will showcase new packaging options for the CVD high power laser line at booth # 2029 at SPIE Photonics West.

The compact package features coaxial cable construction that permits a fiber option for lasers in a much smaller footprint than the standard TO5F housing. LDI’s new fiber coaxial packaging is available for 850 nm, 905 nm, and 1550 nm single-chip and stacked devices.  

The packaging is designed for stability and high bandwidth capability. The product is good for use in optical sensors, cloud measurement, range finding, and industrial applications.



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