Tampere, Finland - A laser welding machine for microelectromechanical systems (MEMS) has been introduced by Primoceler Inc. This laser welder produces an extremely small heat-affected zone (HAZ) during the hermetic sealing of sensitive or organic components, eliminating the risk of damaging those components.
The company that purchased the first machine will use it for a process that was not possible with its old techniques and equipment.
"The fact is, our technology is unique in the industry," said Ville Hevonkorpi, Primoceler's managing director. "Before this, manufacturers had to rely on fusion bonding and anodic bonding, both of which generate large amounts of heat, damaging sensitive components. Our new laser microwelding methodology and diminutive HAZ expands the potential for packaging fragile components, including under or inside glass, which has been a major challenge for manufacturers."
In addition to most types of glass, the machine is suitable for welding silicon. The new process makes it possible to leave the surface of the material untouched while welding, which means that treated surfaces will not be damaged during the process. The technology also opens new possibilities for the production of electronic, engineering, medical and scientific research devices such as chips and sensors.
Besides producing a small HAZ, the technology makes it possible to bond silicon and glass hermetically without adhesives. The resulting welding seams have strong mechanical properties, and they retain their quality over time. An additional benefit of the lack of adhesive material is that the microwelding operation is now a simplified, one-step welding process.
For more information contact Antti Peltonen at email@example.com
Photo: Primoceler microwelding machine. (PRNewsFoto/Primoceler Inc.)