LPKF introduces laser direct structuring for 3D circuits with the Fusion 3D 1100 system


LPKF Laser & Electronics, Garbsen, Germany, introduces the new Fusion3D 1100 system, designed to create three dimensional circuits and laser-structuring of molded interconnect devices (MID) for small volume production. The system is easy to install and can be incorporated into any work environment due to its compact size. 

The Fusion3D 1100 has no restrictions in terms of 3D freedom and utilizes laser direct structuring technology (LDS) and MID to combine both mechanical structures and electronic circuits into a single 3D part. MID consists of circuit traces embedded into molded thermoplastics, which creates an electrical pathway. The 3D circuits are structured by using LDS-grade resin, which is laser activated by a scanner-based laser system. The circuit pattern is written directly on the molded piece, and conductive paths are plated using electroless plating technology, adhering only to where the plastic has been activated by the laser beam. 

LPKF is expecting to start delivery of the Fusion3D 1100 systems to North American customers in July 2011.

Get All the Industrial Laser Solutions News Delivered to Your Inbox

Subscribe to Industrial Laser Solutions Magazine or email newsletter today at no cost and receive the latest news and information.

 Subscribe Now
ILS Blogs
David Belforte
David Beleforte

Let's grow LME

Mon Apr 22 08:51:00 CDT 2013

Looked at manufacturing lately?

Wed Mar 20 09:57:00 CDT 2013

Industrial laser market meets forecast

Fri Mar 08 10:59:00 CST 2013

Photonics West features ultra-fast and fiber lasers

Mon Feb 18 13:31:00 CST 2013

Follow us at Join us on

Twitter - Industrial Laser Solutions


There is no current content available.
There is no current content available.

See Article Archive

View Industrial Laser Solutions past articles.

Copyright © 2007-2016. PennWell Corporation, Tulsa, OK. All Rights Reserved.PRIVACY POLICY | TERMS AND CONDITIONS