| Archives | Laser Welding | Rapid Manufacturing | Products | Laser Micromachining | Laser Surface Treatment | Laser Markets | Laser Safety | Medical Device Processing | Laser Marking | Laser Drilling Nonmetals | Lasers Cutting Metals | Laser Welding Metals | Laser Heat Treating | Laser Drilling Metals | Laser Welding Nonmetals | Lasers Cutting Nonmetals | Laser Melting | Laser Engraving | Laser Cladding | Laser Cutting | Laser Marking and Engraving | Laser Drilling

• 11/28/2011 -- ARGES develops compact Anteater 3D scan head
  ARGES GmbH, Wackersdorf, Germany, has developed the Anteater small, compact, and water-cooled 3D scan head for microprocessing.
• 09/22/2011 -- Ace Precision expands with two laser machining systems
  Champlin, Minn. – Prima Power Laserdyne, a manufacturer of precision multi-axis laser machining systems, has announced that Ace Precision Machining Corp., Oconomowoc, Wis., has taken delivery of two Laserdyne 795XL seven-axis BeamDirector systems.
• 10/19/2011 -- High-speed laser drilling of silicon wafers for photovoltaics
  Aachen, Germany – High-speed laser drilling is an important processing step in the production of high-efficiency solar cells, especially in the case of emitter-wrap-through (EWT) solar cells that require 10,000 and more vias to be drilled in each cell.